Evaluation of ceramic substrates for high power and high temperature applications

Proceedings - 2011 IMAPS/ACerS 7th International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2011

Volumn , Issue , 2011, Pages 199-206

  Kulkarni, Srikanth ^a   Arifeen, Shams ^a   Patterson, Brian ^a   Potirniche, Gabriel ^a   Elshabini, Aicha ^a   Barlow, Fred ^a  

^a UNIVERSITY OF IDAHO   (United States)

Author keywords

Active metal bonded (AMB) substrates; Direct bonded aluminum (DBA); Direct bonded copper (DBC); Finite element modeling; Simulation; Thermal shock test

Indexed keywords

ACTIVE METALS; BONDED ALUMINUM; DIRECT BONDED COPPERS; FINITE ELEMENT MODELING; SIMULATION; THERMAL SHOCK TESTS;

ALUMINUM; ALUMINUM NITRIDE; CERAMIC MATERIALS; COMPUTER SIMULATION; COPPER; CRACK PROPAGATION; CRACKS; DELAMINATION; FAILURE (MECHANICAL); FINITE ELEMENT METHOD; FUNCTION EVALUATION; HIGH TEMPERATURE APPLICATIONS; HIGH TEMPERATURE OPERATIONS; METALS; MICROELECTRONICS; MICROSYSTEMS; THERMAL CYCLING; THERMAL SHOCK; THICK FILMS;

SUBSTRATES;

EID: 84867763216     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

1. J. Schulz-Harder, "Advantages and New Development of Direct Bonded Copper Substrates, " pp. 359-365 in Microelectronics Reliability, 43(3), March 2003.
2. D. A. Cusano, J. A. Loughran, and Y. S. E. Sun, Direct Bonding of Metals to Ceramics and Metals, United States Patent 3, 994, 430, November 30, 1976.
3. Gunther, M.; Wolter, K.J.; Rittner, M.; Niichter, W.;, "Failure Mechanisms of Direct Copper Bonding Substrates (DCB), " Electronics System integration Technology Conference, 2006. vol.2, no.1, pp.714-718, 5-7 Sept. 2006.
4. Gunther, M.; Wolter, K.-J.;, "Material characterization of substrates for power modules, " Electronics Technology, 2006. ISSE '06. 29th International Spring Seminar on, vol., no., pp.20-25, 10-14 May 2006.
5. W. Martin, B. Waibel, and W. Laaser, "Thermal Resistance and Temperature Cycling Endurance of DBC Substrates, " pp. 29-33 in Hybrid Circuits: Journal of the International Society for Hybrid Microelectronics- UK, May 1990.
6. Lindemann, A.; Strauch, G.;, "Properties of direct aluminium bonded substrates for power semiconductor components, " Power Electronics Specialists Conference, 2004. PESC 04. 2004 IEEE 35th Annual, vol.6, no., pp. 4171- 4177 Vol.6, 20-25 June 2004.
7. Guangyin Lei, T.; Calata, J.N.; Ngo, K.D.T.; Guo-Quan, Lu;, "Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate, " Device and Materials Reliability, IEEE Transactions on, vol.9, no.4, pp.563-568, Dec. 2009.
8. http://www.seas.ucla.edu/ethinfilm/PbfreeWorkshop/pdf/pan.pdf.
9. Abaqus/CAE, v.6.9-2, Dassault Systems, 2009.