Properties of direct aluminium bonded substrates for power semiconductor components

PESC Record - IEEE Annual Power Electronics Specialists Conference

Volumn 6, Issue , 2004, Pages 4171-4177

  Lindemann, Andreas ^a   Strauch, Gerhard ^a  

^a IXYS Semiconductor GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINIUM BONDED SUBSTRATES; CERAMIC PLATES; CERAMIC SUBSTRATES; POWER SEMICONDUCTOR COMPONENTS;

ALUMINUM; CERAMIC PRODUCTS; COPPER; MICROPROCESSOR CHIPS; NETWORKS (CIRCUITS); POWER ELECTRONICS; SEMICONDUCTOR DEVICES;

SUBSTRATES;

EID: 8744298606     PISSN: 02759306     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PESC.2004.1354737     Document Type: Conference Paper

References (12)

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