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Volumn , Issue , 2006, Pages 20-25
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Material characterization of substrates for power modules
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Author keywords
[No Author keywords available]
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Indexed keywords
BRAZING;
CERAMIC MATERIALS;
CHIP SCALE PACKAGES;
COPPER;
ELECTRONICS PACKAGING;
FORECASTING;
HEAT STORAGE;
METALS;
PHOTOACOUSTIC EFFECT;
SPRINGS (COMPONENTS);
SUBSTRATES;
TECHNOLOGY;
WELDING;
(O-SEC.-BUTYLDITHIOCARBONATIO-S ,S') COPPER;
CERAMIC SUBSTRATES;
CHARACTERIZATION METHODS;
CONFERENCE PROCEEDINGS;
CONNECTIONS (STRUCTURAL);
ELECTRONICS TECHNOLOGY;
FAILURE CRITERION;
GENERAL (CO);
IN ORDER;
INTERNATIONAL (CO);
LIFETIME PREDICTIONS;
MATERIAL CHARACTERIZATIONS;
MODIFIED SURFACES;
NANO TECHNOLOGIES;
POWER MODULES;
SOLDER JOINTS;
STATE OF STRESS;
STRENGTH (IGC: D5/D6);
ELECTRONIC EQUIPMENT MANUFACTURE;
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EID: 46449083305
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ISSE.2006.365353 Document Type: Conference Paper |
Times cited : (3)
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References (6)
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