Elastic moduli and activation energies for an epoxy/m-XDA system by DMA and DSC

Journal of Thermal Analysis and Calorimetry

Volumn 52, Issue 3, 1998, Pages 1013-1022

  Núñez, Lisardo ^a   Fraga, F ^a   Castro, A ^a   Fraga, L ^a  

^a UNIVERSITY OF SANTIAGO DE COMPOSTELA   (Spain)

Author keywords

Activation energies; DMA; DSC; Elastic moduli; Epoxy resin

Indexed keywords

ACTIVATION ENERGY; AGENTS; AMINES; CROSSLINKING; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELASTIC MODULI; EPOXY RESINS; GLASS TRANSITION; REACTION KINETICS; THERMAL EFFECTS; THERMOSETS;

DIGLYCIDYL ETHER; DYNAMIC MECHANICAL ANALYSIS; XYLYLENEDIAMINE;

ETHERS;

EID: 0032295278     PISSN: 14182874     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1010192808840     Document Type: Article

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