Curing and thermal behavior of epoxy resin in the presence of silicon-containing amide amines

Journal of Applied Polymer Science

Volumn 87, Issue 8, 2002, Pages 1345-1353

  Khurana, Parveen ^a   Aggarwal, S ^a   Narula, A K ^a   Choudhary, Veena ^b  

^a GURU GOBIND SINGH INDRAPRASTHA UNIVERSITY   (India)

^b INDIAN INSTITUTE OF TECHNOLOGY DELHI   (India)

Author keywords

[No Author keywords available]

Indexed keywords

AGENTS; AMINES; CRYSTAL STRUCTURE; CURING; DIFFERENTIAL SCANNING CALORIMETRY; FOURIER TRANSFORM INFRARED SPECTROSCOPY; MOLECULAR WEIGHT; SILICON; STOICHIOMETRY; SYNTHESIS (CHEMICAL); THERMODYNAMIC PROPERTIES;

BISPHENOL; DIGLYCIDYL ETHER; DIMETHYL ACETAMIDE; EXOTHERMIC REACTION;

EPOXY RESINS;

CURING; EPOXY RESIN;

EID: 0037155299     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.11346     Document Type: Article

References (10)

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