Thermal conductivity enhancement of epoxy composites by interfacial covalent bonding for underfill and thermal interfacial materials in Cu/Low-K application

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 10, 2012, Pages 1571-1579

  Liang, Qizhen ^a   Moon, Kyoung Sik ^a   Jiang, Hongjin ^a   Wong, Ching Ping ^a,b  

^a Georgia Institute of Technology   (United States)

^b CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Epoxy composite; interfacial covalent bonding; multiwalled carbon nanotube (MWNT); silicon carbide (SiC); thermal conductivity

Indexed keywords

ACID MIXTURES; CONDUCTIVE SILICON; COVALENT BONDING; COVALENT CHEMICAL BONDING; EPOXY COMPOSITE; FUNCTIONALIZED; INTERFACIAL CHEMICALS; OPERATION TEMPERATURE; PHOTONICS DEVICES; SIC PARTICLES; THERMAL CONDUCTIVITY ENHANCEMENT; THERMAL OXIDATION; THERMALLY CONDUCTIVE FILLERS; ULTRATHIN LAYERS; UNDERFILLS;

CHARACTERIZATION; CHEMICAL BONDS; CONDUCTIVE MATERIALS; EPOXY RESINS; FILLERS; MULTIWALLED CARBON NANOTUBES (MWCN); RESINS; SILICON CARBIDE; SILICON OXIDES; THERMAL INSULATING MATERIALS; THERMOGRAVIMETRIC ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY;

THERMAL CONDUCTIVITY;

EID: 84867216341     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2204885     Document Type: Article

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