Electrodeposition, structural, and corrosion properties of Cu films from a stable deep eutectics system with additive of ethylene diamine

Surface and Coatings Technology

Volumn 209, Issue , 2012, Pages 117-123

  Gu, C D ^a   You, Y H ^a   Wang, X L ^a   Tu, J P ^a  

^a ZHEJIANG UNIVERSITY   (China)

Author keywords

Additive; Copper; Corrosion resistance; Electrodeposition; Ionic liquids

Indexed keywords

BASE ELECTROLYTES; COLUMNAR GRAIN; COMPARATIVE STUDIES; CORROSION CURRENT DENSITIES; CORROSION PROPERTY; CU FILMS; DEPOSITION MECHANISM; ETHYLENE DIAMINE; FINE GRAINED; FINER GRAINS; UNIFORM CORROSION;

ADDITIVES; CHLORINE COMPOUNDS; COPPER; COPPER COMPOUNDS; COPPER DEPOSITS; CORROSION RESISTANCE; ELECTRODEPOSITION; ELECTROLYTES; ETHYLENE; ETHYLENE GLYCOL; EUTECTICS; IONIC LIQUIDS; ORGANIC SOLVENTS;

METALLIC FILMS;

EID: 84866879675     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2012.08.047     Document Type: Article

References (30)

1. Abbott A.P., El Ttaib K., Frisch G., McKenzie K.J., Ryder K.S. Phys. Chem. Chem. Phys. 2009, 11:4269.
2. Cerisier M., Attenborough K., Fransaer J., Van Haesendonck C., Celis J.P. J. Electrochem. Soc. 1999, 146:2156.
3. Grujicic D., Pesic B. Electrochim. Acta 2002, 47:2901.
4. Donepudi V.S., Venkatachalapathy R., Ozemoyah P.O., Johnson C.S., Prakash J. Electrochem. Solid State Lett. 2001, 4:C13.
5. Huang C.A., Wang T.H., Weirich T., Neubert V. Corros. Sci. 2008, 50:1385.
6. Tjong S.C., Chen H. Mater. Sci. Eng. R 2004, 45:1.
7. Lu L., Shen Y., Chen X., Qian L., Lu K. Science 2004, 304:422.
8. Wang Y., Chen M., Zhou F., Ma E. Nature 2002, 419:912.
9. Robertson A., Erb U., Palumbo G. Nanostruct. Mater. 1999, 12:1035.
10. Gu C.D., Lian J.S., He J.G., Jiang Z.H., Jiang Q. Surf. Coat. Technol. 2006, 200:5413.
11. Roy I., Yang H.W., Dinh L., Lund I., Earthman J.C., Mohamed F.A. Scripta Mater. 2008, 59:305.
12. Gu C.D., You Y.H., Yu Y.L., Qu S.X., Tu J.P. Surf. Coat. Technol. 2011, 205:4928.
13. Johannsen K., Page D., Roy S. Electrochim. Acta 2000, 45:3691.
14. Correia A.N., Façanha M.X., de Lima-Neto P. Surf. Coat. Technol. 2007, 201:7216.
15. Armand M., Endres F., MacFarlane D.R., Ohno H., Scrosati B. Nat. Mater. 2009, 8:621.
16. Endres F. ChemPhyschem 2002, 3:144.
17. El Abedin S.Z., Polleth M., Meiss S.A., Janek J., Endres F. Green Chem. 2007, 9:549.
18. Chen P.Y., Sun I.W. Electrochim. Acta 1999, 45:441.
19. Murase K., Nitta K., Hirato T., Awakura Y. J. Appl. Electrochem. 2001, 31:1089.
20. Abbott A.P., Boothby D., Capper G., Davies D.L., Rasheed R.K. J. Am. Chem. Soc. 2004, 126:9142.
21. Abbott A.P., Ryder K.S., Konig U. Trans. Inst. Met. Finish. 2008, 86:196.
22. Whitehead A.H., Polzler M., Gollas B. J. Electrochem. Soc. 2010, 157:D328.
23. Abbott A.P., Barron J.C., Frisch G., Ryder K.S., Silva A.F. Electrochim. Acta 2011, 56:5272.
24. Gu C.D., Tu J.P. Langmuir 2011, 27:10132.
25. You Y.H., Gu C.D., Wang X.L., Tu J.P. Surf. Coat. Technol. 2012, 206:3632.
26. Gu C.D., Mai Y.J., Zhou J.P., You Y.H., Tu J.P. J. Power Sources 2012, 214:200.
27. Abbott A.P., El Ttaib K., Ryder K.S., Smith E.L. Trans. Inst. Met. Finish. 2008, 86:234.
28. Haerens K., Matthijs E., Binnemans K., Van der Bruggen B. Green Chem. 2009, 11:1357.
29. Bento F.R., Mascaro L.H. Surf. Coat. Technol. 2006, 201:1752.
30. Gu C.D., Lian J.S., Li G.Y., Niu L.Y., Jiang Z.H. Surf. Coat. Technol. 2005, 197:61.