Metal semiconductor (MES) TSVs in 3D ICs: Electrical modeling and design

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Volumn , Issue , 2011, Pages

  Engin, A Ege ^a   Raghavan, N Srinidhi ^a  

^a AGC Paul S Roel Chair in Construction Engineering and Management   (United States)

Author keywords

3D IC; cross talk; metal insular semiconductor transmission line; through silicon via

Indexed keywords

3-D ICS; DIELECTRIC LINERS; ELECTRICAL DESIGN; ELECTRICAL MODELING; HIGH FREQUENCY SIGNALS; METAL INSULATOR SEMICONDUCTOR STRUCTURES; METAL SEMICONDUCTORS; QUASI-TEM; SILICON SUBSTRATES; SLOW WAVE; THROUGH-SILICON-VIA;

CROSSTALK; ELECTRIC LINES; MIS DEVICES; THREE DIMENSIONAL COMPUTER GRAPHICS; TRANSMISSION LINE THEORY;

METALS;

EID: 84866878450     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2012.6263049     Document Type: Conference Paper

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