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Volumn 52, Issue 9-10, 2012, Pages 2397-2402
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Mechanical analysis of press-pack IGBTs
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Author keywords
[No Author keywords available]
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Indexed keywords
3D MODELS;
BONDING WIRES;
FAILURE MECHANISM;
FEM SIMULATIONS;
IGBT DEVICES;
LIFETIME ESTIMATION;
LIMITED DATA;
MANUFACTURING PROCESS;
MECHANICAL ANALYSIS;
POWER CYCLING;
POWER MODULE;
POWER RANGE;
PRESS PACK;
SOLDER LAYERS;
THERMO-MECHANICAL;
VARIABLE OPERATING CONDITION;
ELECTRIC POWER SYSTEMS;
FINITE ELEMENT METHOD;
THREE DIMENSIONAL COMPUTER GRAPHICS;
PRESSES (MACHINE TOOLS);
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EID: 84866737115
PISSN: 00262714
EISSN: None
Source Type: Journal
DOI: 10.1016/j.microrel.2012.06.079 Document Type: Article |
Times cited : (76)
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References (7)
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