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Volumn 52, Issue 9-10, 2012, Pages 2397-2402

Mechanical analysis of press-pack IGBTs

Author keywords

[No Author keywords available]

Indexed keywords

3D MODELS; BONDING WIRES; FAILURE MECHANISM; FEM SIMULATIONS; IGBT DEVICES; LIFETIME ESTIMATION; LIMITED DATA; MANUFACTURING PROCESS; MECHANICAL ANALYSIS; POWER CYCLING; POWER MODULE; POWER RANGE; PRESS PACK; SOLDER LAYERS; THERMO-MECHANICAL; VARIABLE OPERATING CONDITION;

EID: 84866737115     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2012.06.079     Document Type: Article
Times cited : (76)

References (7)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.