Thermo-mechanical simulation of a multichip press-packed IGBT

Solid-State Electronics

Volumn 42, Issue 12, 1998, Pages 2303-2307

  Pirondi, A ^a   Nicoletto, G ^a   Cova, P ^a   Pasqualetti, M ^b   Portesine, M ^b   Zani, P E ^b  

^a UNIVERSITY OF PARMA   (Italy)

^b ANSALDO ENERGIA   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE ELEMENT METHOD; MULTICHIP MODULES; SEMICONDUCTOR DEVICE MODELS; THERMAL CYCLING; THERMOMECHANICAL TREATMENT;

COULOMBIAN FRICTION; INSULATED GATE BIPOLAR TRANSISTORS (IGBT);

BIPOLAR TRANSISTORS;

EID: 0032300805     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0038-1101(98)00229-9     Document Type: Article

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