Copper electromigration failure times evaluated over a wide range of voiding phases

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2012, Pages

  Li, Yunlong ^a   Croes, Kristof ^a   Kirimura, Tomoyuki ^b   Siew, Yong Kong ^a   Tokei, Zsolt ^a  

^a IMEC   (Belgium)

^b Fujitsu Semiconductor Europe   (Belgium)

Author keywords

activation energy; BEOL; electromigration; lifetime distribution width; local sense structure; test time reduction; void formation and growth

Indexed keywords

ACTIVATION ENERGY E; BEOL; COPPER ELECTROMIGRATION; DIFFUSION PATHS; DUAL DAMASCENE; ELECTROMIGRATION FAILURES; FAILURE CRITERIA; LIFE-TIME DISTRIBUTION; TEST TIME REDUCTION; VOID FORMATION;

ACTIVATION ENERGY;

ELECTROMIGRATION;

EID: 84866631592     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IRPS.2012.6241894     Document Type: Conference Paper

References (6)

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