Analysis of electromigration statistics for Cu interconnects

Applied Physics Letters

Volumn 88, Issue 21, 2006, Pages

  Hauschildt, M ^a   Gall, M ^a   Thrasher, S ^a   Justison, P ^a   Michaelson, L ^a   Hernandez, R ^a   Kawasaki, H ^a   Ho, P S ^b  

^a FREESCALE SEMICONDUCTOR INC   (United States)

^b UNIVERSITY OF TEXAS AT AUSTIN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FAILURE STATISTICS; LOGNORMAL STANDARD DEVIATION; MASS TRANSPORT; VOID EVOLUTION;

COMPUTER SIMULATION; COPPER; CORRELATION METHODS; ELECTROMIGRATION; STATISTICAL METHODS;

OPTICAL INTERCONNECTS;

EID: 33744541179     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2201872     Document Type: Article

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