Highly accelerated electromigration lifetime test (HALT) of copper

IEEE Transactions on Device and Materials Reliability

Volumn 3, Issue 4, 2003, Pages 213-217

  Aubel, Oliver ^a   Hasse, Wolfgang ^a   Hommel, Martina ^b  

^a LEIBNIZ UNIVERSITY HANNOVER   (Germany)

^b INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

Bimodal behavior; Electromigration; Measurement

Indexed keywords

ACCELERATION; ACTIVATION ENERGY; COPPER; CURRENT DENSITY; ESTIMATION; EXTRAPOLATION; RELIABILITY; ULSI CIRCUITS;

BIMODAL BEHAVIOR; COPPER INTERCONNECTS; LIFETIME TESTS;

ELECTROMIGRATION;

EID: 3042766102     PISSN: 15304388     EISSN: None     Source Type: Journal    
DOI: 10.1109/TDMR.2003.820055     Document Type: Article

References (9)

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