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Electrochimica Acta

Volumn 82, Issue , 2012, Pages 367-371

Seedless copper electroplating on Ta from an alkaline activated bath

(3) Starosvetsky, David a Sezin, Nina a Ein Eli, Yair a

a TECHNION ISRAEL INSTITUTE OF TECHNOLOGY (Israel)

Author keywords

Electroplating; Oxide removal; Seedless copper; Single bath; Ta barrier

Indexed keywords

APPLIED POTENTIALS; BARRIER FILMS; COPPER ELECTRODEPOSITION; COPPER ELECTROPLATING; COPPER INTERCONNECTS; COPPER LAYER; CU ELECTROPLATING; ELECTROCHEMICAL BATH; ELECTROLYTIC BATHS; FEATURE DIMENSIONS; METALLIZATION TECHNIQUES; NEGATIVE POTENTIAL; NUCLEATION AND GROWTH; OXIDE REMOVAL; SEED LAYER; SEED LAYER THICKNESS; SHORT PERIODS; SINGLE BATH; TWO-COMPONENT;

ELECTROPLATING; TANTALUM OXIDES;

COPPER;

EID: 84866432135 PISSN: 00134686 EISSN: None Source Type: Journal
DOI: 10.1016/j.electacta.2012.03.033 Document Type: Conference Paper

Times cited : (7)

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