|
Volumn 154, Issue 8, 2007, Pages
|
Electrodeposition of Cu on Ta-based layers: I. Electrodeposition on Ta
|
Author keywords
[No Author keywords available]
|
Indexed keywords
ACID SULFATE COPPER PLATING ELECTROLYTES;
BASIC CITRATE ELECTROLYTES;
CITRATE CHEMISTRY;
HIGH CURRENT EFFICIENCY;
DEPOSITION RATES;
ELECTRODEPOSITION;
ELECTROLYTES;
NUCLEATION;
TANTALUM;
COPPER COMPOUNDS;
|
EID: 34347351323
PISSN: 00134651
EISSN: None
Source Type: Journal
DOI: 10.1149/1.2744153 Document Type: Article |
Times cited : (15)
|
References (13)
|