Cup-shaped copper heat spreader in multi-chip high-power LEDs application

Optics Express

Volumn 20, Issue 105, 2012, Pages A597-A605

  Horng, Ray Hua ^a   Hu, Hung Lieh ^a,c   Lin, Re Ching ^a   Tang, Li Shen ^a   Hsu, Chen Peng ^b   Ou, Sin Liang ^a  

^a NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

^c NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROPLATING; SAPPHIRE;

COPPER HEAT SPREADER; COPPER SHEETS; ELECTROPLATING TECHNIQUE; HIGH CURRENTS; HIGH POWER LED; HIGH THERMAL; HIGH-POWER; LED ARRAYS; LED CHIPS; LIGHT EXTRACTION; LIGHT OUTPUT POWER; MULTI-CHIP; SILVER MIRROR; SURFACE TEMPERATURES;

LIGHT EMITTING DIODES;

EID: 84866250116     PISSN: None     EISSN: 10944087     Source Type: Journal    
DOI: 10.1364/OE.20.00A597     Document Type: Article

References (15)

1. K. C. Chen, R. W. Chuang, Y. K. Su, C. L. Lin, H. C. Hsu, J. Q. Huang, and K. F. Yang, “High thermal dissipation of ultra high power light-emitting diodes by copper electroplating,” in Proceedings of 57th IEEE Electronic Components and Technology Conference (IEEE, 2007), pp. 734—736.
2. L. Yuan, S. Liu, M. Chen, and X. Luo, “Thermal analysis of high power LED array packaging with microchannel cooler,” in Proceedings of 7th Electronics Packaging Technology Conference (IEEE, 2006), pp. 1-5.
3. W. Y. Lin, D. S. Wuu, K. F. Pan, S. H. Huang, C. E. Lee, W. K. Wang, S. C. Hsu, Y. Y. Su, S. Y. Huang, and R. H. Horng, “High-power GaN-mirror-Cu light-emitting diodes for vertical current injection using laser liftoff and electroplating techniques,” IEEE Photon. Technol. Lett. 17(9), 1809-1811 (2005).
4. T. Tamura, T. Setomoto, and T. Taguchi, “Illumination characteristics of lighting array using 10 candela-class white LEDs under AC 100 V operation,” J. Lumin. 87-89, 1180-1182 (2000).
5. S. F. Wong, P. Malatkar, C. Rick, V. Kulkarni, and I. Chin, “Vibration testing and analysis of ball grid array package solder joints,” in Proceedings of 57th IEEE Electronic Components and Technology Conference (IEEE, 2007), pp. 373-380.
6. R. H. Horng, C. C. Chiang, H. Y. Hsiao, X. Zheng, D. S. Wuu, and H. I. Lin, “Improved thermal management of GaN/sapphire light-emitting diodes embedded in reflective heat spreaders,” Appl. Phys. Lett. 93(11), 111-907 (2008).
7. R. H. Horng, H. Y. Hsiao, C. C. Chiang, D. S. Wuu, Y. L. Tsai, and H. I. Lin, “Novel device design for highpower InGaN/sapphire LEDs using copper heat spreader with reflector,” IEEE J. Sel. Top. Quantum Electron. 15(4), 1281-1286 (2009).
8. R. H. Horng, W. K. Wang, S. Y. Huang, and D. S. Wuu, “Effect of resonant cavity in wafer-bonded green InGaN LED with dielectric and silver mirrors,” IEEE Photon. Technol. Lett. 18(3), 457-459 (2006).
9. L. Kim, J. H. Choi, S. H. Jang, and M. W. Shin, “Thermal analysis of LED array system with heat pipe,” Thermochim. Acta 455(1-2), 21-25 (2006).
10. L. Kim and M. W. Shin, “Thermal resistance measurement of LED package with multichips,” IEEE Trans. Compon. Packag. Tech. 30(4), 632-636 (2007).
11. N. Narendran and Y. Gu, “Life of LED-based white light sources,” IEEE Photon. Technol. Lett. 1(1), 167-171 (2005).
12. G. Faekas, Q. V. V. Vader, A. Poppe, and G. Bognar, “Thermal investigation of high power optical device by transient testing,” in Proceedings of 9th International Workshop on Thermal Investigations of ICs and Systems(IEEE, 2003), pp. 213-218.
13. R. H. Horng, J. S. Hong, Y. L. Tsai, D. S. Wuu, C. M. Chen, and C. J. Chen, “Optimized thermal management from a chip to a heat sink for high-power GaN-based light-emitting diodes,” IEEE Trans. Electron. Dev. 57(9), 2203-2207 (2010).
14. S. Nakamura, M. Senoh, N. Iwasa, and S. Nagahama, “High-power InGaN single-quantum-well-structure blue and violet light-emitting diodes,” Appl. Phys. Lett. 67(13), 1868 (1995).
15. B. Zhang, T. Egawa, H. Ishikawa, Y. Liu, and T. Jimbo, “Thermal stability of InGaN multiple-quantum-well light-emitting diodes on an AlN/sapphire template,” J. Appl. Phys. 95(6), 3170 (2004)