Solder-bonded carbon nanotube thermal interface materials

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn , Issue , 2012, Pages 1225-1233

  Barako, Michael T ^a   Gao, Yuan ^a   Marconnet, Amy M ^a   Asheghi, Mehdi ^a   Goodson, Kenneth E ^a  

^a Stanford University   (United States)

Author keywords

indium bonding; infrared thermometry; Nanofoil; thermal interface

Indexed keywords

BONDING LAYERS; CARBON NANOTUBE FILMS; CNT FILMS; HIGH THERMAL; INDIUM FOILS; INFRARED MICROSCOPY; INFRARED THERMOMETRY; LOW TEMPERATURES; MECHANICAL COMPLIANCE; NANOFOIL; SILICON GROWTH; SOLDER BONDING; SURROUNDING MATERIALS; THERMAL BOUNDARY RESISTANCE; THERMAL INTERFACE MATERIALS; THERMAL INTERFACES;

CARBON NANOTUBES; COMPRESSIVE STRESS; ELECTRONICS ENGINEERING; INDIUM; THERMAL CONDUCTIVITY OF SOLIDS; TIN;

INTERFACES (MATERIALS);

EID: 84866152547     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2012.6231562     Document Type: Conference Paper

References (19)

1. E. Pop, et al., "Thermal Conductance of an Individual Single-Wall Carbon Nanotube above Room Temperature," Nano Letters, vol. 6, pp. 96-100, 2006.
2. Y. Won, et al., "Mechanical characterization of aligned multi-walled carbon nanotube films using microfabricated resonators," Carbon, vol. 50, pp. 347-355, 2012.
3. Y. Gao, et al., "Nanostructured Interfaces for Thermoelectrics, " Journal of Electronic Materials, vol. 39, pp. 1456-1462, 2010.
4. S. V. Aradhya, et al., "Electrothermally bonded carbon nanotube interfaces," in Thermal and Thermomechanical Phenomena in Electronic Systems, 2008. ITHERM 2008. 11th Intersociety Conference on, 2008, pp. 1071-1077.
5. T. Tong, et al., "Dense Vertically Aligned Multiwalled Carbon Nanotube Arrays as Thermal Interface Materials," Components and Packaging Technologies, IEEE Transactions on, vol. 30, pp. 92-100, 2007.
6. X. Wang, et al., "Noncontact thermal characterization of multiwall carbon nanotubes," Journal of Applied Physics, vol. 97, p. 064302, 2005.
7. M. A. Panzer, et al., "Thermal Properties of Metal-Coated Vertically Aligned Single-Wall Nanotube Arrays," Journal of Heat Transfer, vol. 130, p. 052401, 2008.
8. A. M. Marconnet, et al., "Thermal Conduction in Aligned Carbon Nanotube-Polymer Nanocomposites with High Packing Density," ACS Nano, pp. 4818-4825, 2011.
9. S. R. Bakshi, et al., "Carbon nanotube reinforced metal matrix composites - a review," International Materials Reviews, vol. 55, pp. 41-64, 2010.
10. R. Andrews, et al., "Purification and Structural Annealing of Multiwalled Carbon Nanotubes at Graphitization Temperatures," Carbon, vol. 39, pp. 1681-1687, 2001.
11. S. L. Hodson, et al., "Palladium Thiolate Bonding of Carbon Nanotube Thermal Interfaces," Journal of Electronic Packaging, vol. 133, p. 020907, 2011.
12. A. Hamdan, et al., "Evaluation of a thermal interface material fabricated using thermocompression bonding of carbon nanotube turf," Nanotechnology, vol. 21, p. 015702, Jan 8 2010.
13. R. D. Johnson, et al., "Thermocompression bonding of vertically aligned carbon nanotube turfs to metalized substrates," Nanotechnology, vol. 20, p. 065703, Feb 11 2009.
14. R. Cross, et al., "A metallization and bonding approach for high performance carbon nanotube thermal interface materials," Nanotechnology, vol. 21, p. 445705, Nov 5 2010.
15. S. S. Too, et al., "Indium thermal interface material development for microprocessors," in Semiconductor Thermal Measurement and Management Symposium, 2009. SEMI-THERM 2009. 25th Annual IEEE, 2009, pp. 186-192.
16. http://www.indium.com/nanofoil/.
17. Q. Zhang, et al., "Viscoelastic creep of vertically aligned carbon nanotubes," Journal of Physics D: Applied Physics, vol. 43, p. 315401, 2010.
18. C. P. Deck, et al., "Mechanical behavior of ultralong multiwalled carbon nanotube mats," Journal of Applied Physics, vol. 101, p. 023512, 2007.
19. M. A. Panzer, et al., "Composite Thermal Interface Material Including Aligned Nanofiber with Low Melting Temperature Binder 2009/0068387A1," United States Patent, 2007.