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Volumn , Issue , 2009, Pages 186-192
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Indium thermal interface material development for microprocessors
a
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Author keywords
Flux; Indium; Lid attach process; Thermal interface material
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Indexed keywords
ASSEMBLY APPROACH;
DIRECT BONDING;
GOLD METALLIZATION;
HALOGEN-FREE;
HIGH POWER ELECTRONICS;
HIGH-TEMPERATURE STORAGE;
HIGHLY ACCELERATED STRESS TESTS;
INDIUM SOLDERS;
LID ATTACH PROCESS;
MANUFACTURABILITY;
NEGATIVE IMPACTS;
OPTIMAL THERMAL DESIGN;
POWER CYCLE;
PROCESS DEVELOPMENT;
REFLOW PROCESS;
RELIABILITY TEST;
SPRAY EQUIPMENT;
THERMAL DESIGNS;
THERMAL INTERFACE MATERIAL;
THERMAL INTERFACE MATERIALS;
THERMOMECHANICAL PROPERTIES;
VIBRATION TEST;
VOID FORMATION;
WETTING CHARACTERISTICS;
BRAZING;
DOMES;
ELECTRIC BATTERIES;
ELECTRONIC EQUIPMENT;
ELECTROPLATING;
FATIGUE OF MATERIALS;
HIGH TEMPERATURE SUPERCONDUCTORS;
MECHANICAL PROPERTIES;
MICROPROCESSOR CHIPS;
PREFORMING;
RELIABILITY;
TECHNOLOGICAL FORECASTING;
TESTING;
THERMAL INSULATING MATERIALS;
THERMAL VARIABLES MEASUREMENT;
WELDING;
INDIUM;
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EID: 67649870738
PISSN: 10652221
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/STHERM.2009.4810762 Document Type: Conference Paper |
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Times cited : (30)
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References (5)
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