Nanostructured interfaces for thermoelectrics

Journal of Electronic Materials

Volumn 39, Issue 9, 2010, Pages 1456-1462

  Gao, Y ^a   Marconnet, A M ^a   Panzer, M A ^a   Leblanc, S ^a   Dogbe, S ^a   Ezzahri, Y ^b   Shakouri, A ^b   Goodson, K E ^a  

^a Stanford University   (United States)

^b University of California Santa Cruz   (United States)

Author keywords

silicon germanium; Thermal interface materials; thermoelectric modules; thermomechanical stress; thermoreflectance thermometry; vertically aligned carbon nanotubes

Indexed keywords

SILICON GERMANIUM; THERMAL INTERFACE MATERIALS; THERMO-MECHANICAL STRESS; THERMOELECTRIC MODULES; THERMOREFLECTANCE; VERTICALLY ALIGNED CARBON NANOTUBE;

CARBON NANOTUBES; GERMANIUM; HYBRID MATERIALS; STRESSES; TEMPERATURE SENSORS; THERMAL INSULATING MATERIALS; THERMODYNAMIC PROPERTIES; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY; THERMOMETERS;

FILMS;

EID: 77956225217     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-010-1256-7     Document Type: Article

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