-
1
-
-
33947269110
-
Cooling a microprocessor chip
-
R. Mahajan, C. Chiu and G. Chrysler, "Cooling a microprocessor chip," Proceedings of the IEEE, Vol. 94, No. 8, pp. 1476-1486, 2006.
-
(2006)
Proceedings of the IEEE
, vol.94
, Issue.8
, pp. 1476-1486
-
-
Mahajan, R.1
Chiu, C.2
Chrysler, G.3
-
3
-
-
33947286619
-
Thermal interface materials: Historical perspective, status, and future directions
-
R. Prasher, "Thermal interface materials: Historical perspective, status, and future directions," Proceedings of the IEEE, Vol. 94, No. 8, pp 1571-1586, 2006.
-
(2006)
Proceedings of the IEEE
, vol.94
, Issue.8
, pp. 1571-1586
-
-
Prasher, R.1
-
4
-
-
4344623961
-
Unusual properties and structure of carbon nanotubes
-
M. G. Dresselhaus, G. Dresselhaus and A. Jorio, "Unusual properties and structure of carbon nanotubes," Annual Review of Materials Research, Vol. 34, pp. 247-278, 2004.
-
(2004)
Annual Review of Materials Research
, vol.34
, pp. 247-278
-
-
Dresselhaus, M.G.1
Dresselhaus, G.2
Jorio, A.3
-
5
-
-
0000765076
-
Unusually high thermal conductivity of carbon nanotubes
-
S. Berber, Y. -K. Kwon and D. Tomanek, "Unusually high thermal conductivity of carbon nanotubes," Physical Review Letters, Vol. 84 No. 20, pp. 4613-4616, 2000.
-
(2000)
Physical Review Letters
, vol.84
, Issue.20
, pp. 4613-4616
-
-
Berber, S.1
Kwon, Y.-K.2
Tomanek, D.3
-
6
-
-
0035914983
-
Thermal transport measurements of individual multiwalled nanotubes
-
Physical Review Letters, pp., 215502/4
-
P. Kim, L. Shi, A. Majumdar and P. L. McEuen, "Thermal transport measurements of individual multiwalled nanotubes," Physical Review Letters, pp. 215502/1-215502/4, Vol. 87, 2001.
-
(2001)
, vol.87
, pp. 215502-215511
-
-
Kim, P.1
Shi, L.2
Majumdar, A.3
McEuen, P.L.4
-
7
-
-
31544440466
-
Interfacial energy and strength of multiwalled-carbon-nanotube-based dry adhesive
-
Y. Zhao et al., "Interfacial energy and strength of multiwalled-carbon-nanotube-based dry adhesive," Journal of Vacuum Science and Technology B Vol. 24 No. 1, pp. 331-335, 2006.
-
(2006)
Journal of Vacuum Science and Technology B
, vol.24
, Issue.1
, pp. 331-335
-
-
Zhao, Y.1
-
8
-
-
0242499391
-
Interfacial heat flow in carbon nanotube suspensions
-
S. T. Huxtable et al., "Interfacial heat flow in carbon nanotube suspensions," Nature Materials, Vol. 2, pp. 731-734, 2003.
-
(2003)
Nature Materials
, vol.2
, pp. 731-734
-
-
Huxtable, S.T.1
-
9
-
-
3142611693
-
Role of thermal boundary resistance on the heat flow in carbon-nanotube composites
-
S. Shenogin, L. Xue, R. Ozisik, P. Keblinski and D.G. Cahill, "Role of thermal boundary resistance on the heat flow in carbon-nanotube composites," Journal of Applied Physics, Vol. 95 No. 12, pp. 8136-8144, 2004.
-
(2004)
Journal of Applied Physics
, vol.95
, Issue.12
, pp. 8136-8144
-
-
Shenogin, S.1
Xue, L.2
Ozisik, R.3
Keblinski, P.4
Cahill, D.G.5
-
10
-
-
0042991275
-
Ballistic carbon nanotube transistors
-
A. Javey, J. Guo, Q. Wang, M. Lundstrom and H. Dai, "Ballistic carbon nanotube transistors," Nature Vol. 424, pp. 654-657, 2003.
-
(2003)
Nature
, vol.424
, pp. 654-657
-
-
Javey, A.1
Guo, J.2
Wang, Q.3
Lundstrom, M.4
Dai, H.5
-
11
-
-
8644228615
-
Carbon nanotube vias for future LSI interconnects
-
M. Nihei, M. Horibe, A. Kawabata and Y. Awano, "Carbon nanotube vias for future LSI interconnects," Proceedings of IEEE Interconnect Technology Conference, pp. 251-253, 2004.
-
(2004)
Proceedings of IEEE Interconnect Technology Conference
, pp. 251-253
-
-
Nihei, M.1
Horibe, M.2
Kawabata, A.3
Awano, Y.4
-
12
-
-
0032614777
-
Contact resistance of carbon nanotubes
-
J. Tersoff, "Contact resistance of carbon nanotubes," Applied Physics Letters, Vol. 74, pp. 2122-2124, 1999.
-
(1999)
Applied Physics Letters
, vol.74
, pp. 2122-2124
-
-
Tersoff, J.1
-
13
-
-
33947303843
-
-
B. Cola et al., Photoacoustic characterization of carbon nanotube array thermal interfaces, Journal of Applied Physics, 101, pp. 054313/1-054313/9, 2007.
-
B. Cola et al., "Photoacoustic characterization of carbon nanotube array thermal interfaces," Journal of Applied Physics, Vol. 101, pp. 054313/1-054313/9, 2007.
-
-
-
-
14
-
-
28144450558
-
Predicting the thermal resistance of nanosized constrictions
-
R. Prasher, "Predicting the thermal resistance of nanosized constrictions," Nano Letters, Vol. 5, No. 11, pp. 2155-2159, 2005.
-
(2005)
Nano Letters
, vol.5
, Issue.11
, pp. 2155-2159
-
-
Prasher, R.1
-
15
-
-
33744827439
-
Enhanced thermal contact conductance using carbon nanotube array interfaces
-
J. Xu and T. S. Fisher, "Enhanced thermal contact conductance using carbon nanotube array interfaces," IEEE Transactions on Components Packaging Technologies, Vol. 29, pp. 261-267, 2006.
-
(2006)
IEEE Transactions on Components Packaging Technologies
, vol.29
, pp. 261-267
-
-
Xu, J.1
Fisher, T.S.2
-
16
-
-
0002284323
-
Bonding techniques for microsystems
-
Elsevier, Amsterdam
-
W. H. Ko, J. T. Suminto and G. J. Yeh, "Bonding techniques for microsystems," Micromachining and Micropackaging of Transducers, pp. 45-56, Elsevier, Amsterdam, 1985.
-
(1985)
Micromachining and Micropackaging of Transducers
, pp. 45-56
-
-
Ko, W.H.1
Suminto, J.T.2
Yeh, G.J.3
-
17
-
-
0032074033
-
In situ investigation of ion drift processes in glass during anodic bonding
-
B. Schmidt et al., "In situ investigation of ion drift processes in glass during anodic bonding," Sensors and Actuators A, Vol. 67, pp. 191-198, 1998.
-
(1998)
Sensors and Actuators A
, vol.67
, pp. 191-198
-
-
Schmidt, B.1
-
18
-
-
20444468850
-
4 glass and Si
-
4 glass and Si," Materials Letters, Vol. 59, pp. 2492-2495, 2005.
-
(2005)
Materials Letters
, vol.59
, pp. 2492-2495
-
-
Yu, P.1
-
19
-
-
34250703087
-
Electronic properties of alkali-metal intercalated single walled carbon nanotubes
-
A. Cupolillo, C. Giallombardo and L. Papagno "Electronic properties of alkali-metal intercalated single walled carbon nanotubes", Surface Science, Vol. 601, No. 13, pp. 2828-2831, 2007.
-
(2007)
Surface Science
, vol.601
, Issue.13
, pp. 2828-2831
-
-
Cupolillo, A.1
Giallombardo, C.2
Papagno, L.3
-
20
-
-
0031339460
-
Experimental analysis of the anodic bonding with an evaporated glass layer
-
W. B. Choi et al., "Experimental analysis of the anodic bonding with an evaporated glass layer," Journal of Micromechanics and Microengineering, Vol. 7, pp. 316-322, 1997.
-
(1997)
Journal of Micromechanics and Microengineering
, vol.7
, pp. 316-322
-
-
Choi, W.B.1
|