Solution processed aluminum paper for flexible electronics

Langmuir

Volumn 28, Issue 36, 2012, Pages 13127-13135

  Lee, Hye Moon ^a   Lee, Ha Beom ^b   Jung, Dae Soo ^b   Yun, Jung Yeul ^a   Ko, Seung Hwan ^b   Park, Seung Bin ^b  

^a Korea Institute of Material Science   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

AL FILMS; ELECTRICAL AND MECHANICAL PROPERTIES; ELECTRICAL CONDUCTIVITY; LOW TEMPERATURES; MECHANICAL PERFORMANCE; MECHANICAL TESTS; PAPER ELECTRONICS; PAPER SUBSTRATE; PAPER-TYPE; SOLUTION PROCESS; SOLUTION-PROCESSED; STAMPING PROCESS; TEM OBSERVATIONS;

ALUMINUM; ELECTRIC CONDUCTIVITY; INK JET PRINTING; MECHANICAL PROPERTIES;

SUBSTRATES;

ALUMINUM; INK; ORGANOMETALLIC COMPOUND;

ARTICLE; CHEMISTRY; ELECTRONICS; INSTRUMENTATION; PAPER; PARTICLE SIZE; SOLUTION AND SOLUBILITY; SURFACE PROPERTY; SYNTHESIS; TEMPERATURE;

ALUMINUM; ELECTRONICS; INK; ORGANOMETALLIC COMPOUNDS; PAPER; PARTICLE SIZE; SOLUTIONS; SURFACE PROPERTIES; TEMPERATURE;

ALUMINIZED PAPERS; ALUMINUM; INK JET PRINTING; LOW TEMPERATURE; RESISTIVITY; STAMPING; SUBSTRATES;

EID: 84866064189     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la302479x     Document Type: Article

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