Optimization and design of a multipass branching microchannel heat sink for electronics cooling

Journal of Electronic Packaging

Volumn 134, Issue 4, 2012, Pages

  Dede, Ercan M ^a  

^a Toyota Motor North America Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

HEAT FLUX; HEAT SINKS; MICROCHANNELS;

BRANCHING CHANNELS; CHANNEL SOLUTION; COOLING APPLICATIONS; ELECTRONICS COOLING; HIGH HEAT FLUX; MICRO CHANNEL HEAT SINKS; MULTI-PASS; MULTI-PHYSICS; OPTIMIZATION AND DESIGN; TOPOLOGY OPTIMIZATION METHOD;

ELECTRONIC COOLING;

EID: 84865743700     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4007159     Document Type: Article

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