Multi-layered SiC microchannel heat sinks - Modeling and experiment

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 352-360

  Skandakumaran, P ^a   Ortega, A ^a   Jamal Eddine, T ^a   Vaidyanathan, R ^b  

^a University of Arizona   (United States)

^b Advanced Ceramics Research Inc   (United States)

Author keywords

Extrusion freeform fabrication; IGBT cooling; Liquid cooling; Microchannel; Multi layered; SiC; Stacked

Indexed keywords

EXTRUSION FREEFORM FABRICATION (EFF); IGBT COOLING; LIQUID COOLING; MICROCHANNELS; MULTI-LAYERED HEAT SINKS; SIC;

CHANNEL FLOW; COOLING; HEAT RESISTANCE; HEAT TRANSFER; HYDRODYNAMICS; NUSSELT NUMBER; SILICON CARBIDE; THERMAL CONDUCTIVITY OF SOLIDS;

HEAT SINKS;

EID: 4444244253     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (16)

1. Ortega, A., 2003, "Air cooling of electronic components: review of research developments in the period 1981-2001 and their impact on our understanding of cooling limits", 2003 ASME IMECE, Washington D.C. Nov. 2003, paper# IMECE 2003-42412.
2. Tuckerman, D.B., and R.F.W. Pease, 1981, "High-performance heat sinking for VLSI", IEEE Electron Dev. Lett. 2, pp. 126-129, May 1981.
3. Phillips, R.J., 1990, "Micro-channel heat sinks, in A. Bar-Cohen A.D. Kraus (Eds.)" Advances in Thermal Modeling of Electronic Components and Systems vol. 2, ASME, New York, Chapter 3.
4. C.B. Sobhan and S.V. Garimella, "A comparative analysis of studies on heat transfer and fluid flow in microchannels," Microscale Thermophys. Eng., Vol. 15, pp. 293-311, 2001.
5. Kern D.Q. and Kraus, A.D. 1972 Extended Surface Heat Transfer. New York: McGraw-Hill Book Company.
6. Vafai, K., and L. Zhu, 1999, "Analysis of two-layered micro-channel heat sink concept in electronic cooling", International Journal of Heat and Mass Transfer, 42, pp. 2287-2297.
7. Pieper, R.J. and Kraus, A.D., "Performance Analysis of Double Stack Cold Plates Covering All Conditions of Asymmetric Heat Loading", ASME Journal of Electronic Packaging. Vol. 20: 296-301, 1998.
8. Beh, S.L., Quadir, G.A., Seetharamu, K.N., Hassan, A.Y., "Steady state finite element analysis of a double stack cold plate with heat losses", Heat and Mass Transfer/Waerme- und Stoffuebertragung, Vol. 39, n 5-6, June 2003, p 519-528.
9. Pieper, R.J. and Michael, S., "Circuit modeling to predict the performance of force-cooled cold plate structures", Proceedings - IEEE International Symposium on Circuits and Systems, v 6,1999, p VI-105-VI-108
10. Wei X.J. and Joshi Y. "Stacked MicroChannel Heat Sinks for Liquid Cooling of Microelectronic Components", Proceedings of ASME IMECE 2000, Florida.
11. Wei, X.J., and Joshi, Y. "Optimization Study of Stacked Micro-Channel Heat Sinks for Micro-Electronic Cooling", IEEE Transactions on Components and Packaging Technologies, Vol. 26, No. 1, March 2003.
12. Bower, C., Ortega, A., Skandakumaran, P., Vaidyanathan, R., Phillips, T., "Heat Transfer in Water-Cooled Silicon Carbide Milli-channel Heat Sinks For High Power Electronic Applications", Proceedings of IMECE 2003, Washington, D.C.
13. R. Vaidyanathan, J. Walish, J. L. Lombardi, P. Calvert, S.Kasichainula, K. Cooper, "Extrusion Freeform Fabrication of functional ceramic prototypes," Journal of Metals, 52 (12), pp. 34-37, (2000).
14. th ed., New York, Wiley, pp. 482-490.
15. Kays and Crawford, Convective Heat and Mass Transfer, 2d Ed. McGraw-Hill Book Company, 1980.
16. Hambley, A, "Electrical Engineering - Principles and Applications" Prentice-Hall Inc. 1997.