Metal microchannel lamination using surface mount adhesives for low-temperature heat exchangers

Journal of Manufacturing Processes

Volumn 13, Issue 2, 2011, Pages 85-95

  Paulraj, Prawin ^a   Paul, Brian K ^a  

^a Oregon State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE BONDING; ASSEMBLY PROCESS; BOND AREAS; BOND JOINTS; BURST PRESSURES; CHANNEL HEIGHT; CHEMICAL-ETCHING PROCESS; DIMENSIONAL CHARACTERIZATION; FAYING SURFACE; LEAK-FREE; LEAK-FREE JOINTS; LOW TEMPERATURES; MATERIAL SAVINGS; MICROCHANNEL ARRAY; OPERATING PRESSURE; SURFACE CONDITIONS; SURFACE MOUNT ADHESIVES;

ADHESIVES; BOND STRENGTH (MATERIALS); MICROCHANNELS; SAFETY FACTOR; SHEET METAL; SURFACE MOUNT TECHNOLOGY; SURFACE ROUGHNESS;

SURFACES;

EID: 80051670421     PISSN: 15266125     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmapro.2011.01.001     Document Type: Article

References (25)

1. B.K. Paul Micro energy and chemical systems and multi-scale fabrication 2005 Springer-Verlag Germany [Chapter 14]
2. B.K. Paul, P. Kwon, and R. Subramanian Understanding limits on fin aspect ratios in counterflow microchannel arrays produced by diffusion bonding J Manuf Sci Eng 128 4 2006 977 983 (Pubitemid 44770145)
3. N. Sharma, B.K. Paul, and T. Doolen Application of surface mount processes for economical production of high-aspect-ratio microchannel arrays J Manuf Processes 7 2 2005 174 181 (Pubitemid 44431009)
4. Azar K. Advanced cooling concepts and their challenges. In: Therminic 2002. 2002. Retrieved April 30, 2007 from: www.qats.com.
5. Ortega A. Air cooling of electronics: a personal perspective 19812001. In: IEEE Semitherm. 2002.
6. H.Y. Zhang, D. Pinjala, T.N. Wong, and Y.K. Joshi Development of liquid cooling techniques for flip chip ball grid array packages with high heat flux dissipations IEEE Trans Compon Package Technol 28 1 2005 127 135 10.1109/TCAPT.2004.843164 (Pubitemid 40406891)
7. J.M. Haake, and B. Faircloth Requirements for long life micro-channel coolers for direct diode laser systems Proc SPIE 5711 2005 121 131 (Pubitemid 40953487)
8. T. Ebert, M. Pajunk, D. Mueller, and W. Priesterath New generation of corrosion-resistant microcoolers Proc SPIE 5711 2005 152 157
9. R.B. Peterson Numerical modeling of conduction effects in microscale counterflow heat exchangers Microscale Thermophys Eng 3 1999 17 30 (Pubitemid 129343209)
10. G. Maranzana, I. Perry, and D. Maillet Mini- and micro-channels: influence of axial conduction in the walls Int J Heat Mass Transfer 47 1718 2004 3993 4004 (Pubitemid 38790942)
11. K. Kanlayasiri, and B.K. Paul A nickel aluminide microchannel array heat exchanger for high-temperature applications J Manuf Processes 6 1 2004 17 25
12. Paul BK, Peterson RB. Microlamination for microtechnology-based energy, chemical, and biological systems. In: ASME IMECE. 1999. p. 4552.
13. Paul BK, Dewey T, Alman D, Wilson RD. Intermetallic microlamination for high-temperature reactors. In: 4th Int. Conf. Microreaction Tech. 2000. p. 23643.
14. Shirzadi AA. Diffusion bonding aluminum alloys and composites: new approaches and modelling. Ph.D thesis. Cambridge: King's College; 1997.
15. Gickler AE, LePrevost FH Jr., Pan T, Jaoquin AM, Blue CA, Santella ML. Aluminum soldering-a new look. In: Int. Brazing Soldering Conf. Technical paper. 2003.
16. Paul BK, Aramphongphun C, Chaplen F, Upson R. An evaluation of packaging architectures for tissue-based microsystems. In: Trans. NAMRI. vol. 31. 2003.
17. Product technical data sheet-Loctite 3615. Retrieved September 1. 2009 from: http://tds.loctite.com/tds5/docs/3615-EN.PDF.
18. J. Godzimirski, and S. Tkaczuk Numerical calculations of adhesive joints subjected to shearing J Theoret Appl Mech 45 2 2007 311 324
19. Chichili D, Bossert R, Brandt J. Investigation of the bond strength of polyimide adhesive. Fermilab, Batavia. IL report TD 98-004. 1998. Retrieved August 2, 2010 from: http://tdserver1.fnal.gov/tdlibry/TD-Notes/ 1998%20Tech%20Notes/TD-98-004.doc.
20. S.P. Jang, S.J. Kim, and K.W. Paik Experimental investigation of thermal characteristics for a microchannel heat sink subject to an impinging jet, using a micro-thermal sensor array Sensors Actuators Ser A 105 2003 211 224
21. H.K. Ma, C. Bo-Ren, G. Jhong-Jhih, and L. Cheng-Yao Development of an OAPCP-micropump liquid cooling system in a laptop Int Commun Heat Mass Transfer 36 3 2009 225 232
22. K. Chowdhury, and S. Sarangi Effect of flow maldistribution on multipassage heat exchanger performance Heat Transf Eng 6 4 1985 45 54 (Pubitemid 16593364)
23. J.B. Kitto, and J.M. Robertson Effects of maldistribution of flow on heat transfer equipment performance Heat Transfer Eng 10 1 1989 18 25
24. S. Lalot, P. Florent, S.K. Lang, and A.E. Bergles Flow maldistribution in heat exchangers Appl Therm Eng 19 1999 847 863
25. Wattanutchariya W. Application of buckling behavior to evaluate and control shape variation in high-temperature microlamination. Ph.D. thesis. Oregon: Oregon State University; 2002.