Microstructural and process characterization of conductive traces printed from Ag particulate inks

Materials

Volumn 4, Issue 6, 2011, Pages 963-979

  Roberson, David A ^a,b   Wicker, Ryan B ^b   Murr, Lawrence E ^a,b   Church, Ken ^b   MacDonald, Eric ^b  

^a UNIVERSITY OF TEXAS AT EL PASO   (United States)

^b University of Texas at El Paso   (United States)

Author keywords

Ag nanoparticles; Conductive ink; Inkjet; Microstructures; Scanning electron microscopy

Indexed keywords

AG NANOPARTICLE; COEFFICIENT OF VARIATION; CONDUCTIVE INK; ELECTRICAL PERFORMANCE; INKJET; PRINTING TECHNIQUES; PROCESS CHARACTERIZATION; RESISTIVITY MEASUREMENT;

CURING; INK; MICROSTRUCTURE; NANOPARTICLES; SCANNING ELECTRON MICROSCOPY; SINTERING;

SILVER;

EID: 84859432320     PISSN: None     EISSN: 19961944     Source Type: Journal    
DOI: 10.3390/ma4060963     Document Type: Article

References (32)

1. Park, B.K.; Kim, D.; Jeong, S.; Moon, J.; Kim, J.S. Direct writing of copper conductive patterns by ink-jet printing. Thin Solid Films 2007, 515, 7706-7711.
2. Zhang, Y.; Liu, C.Q.; Whalley, D. Direct-write technologies for maskless production of microelectronics: A review of current state-of-the-art technologies. In International Conference on Electronic Packaging Technology & High Density Packaging, 2009. ICEPT-HDP '09, Beijing, China, 10-13 August 2009; pp. 497-503.
3. Pudas, M.; Halonen, N.; Granat, P.; Vähäkangas, J. Gravure printing of conductive particulate polymer inks on flexible substrates. Prog. Org. Coating. 2005, 54, 310-316.
4. Merilampi, S.; Laine-Ma, T.; Ruuskanen, P. The characterization of electrically conductive silver ink patterns on flexible substrates. Microelectron. Rel. 2009, 49, 782-790.
5. Lee, H.H.; Chou, K.S.; Huang, K.C. Inkjet printing of nanosized silver colloids. Nanotechnology 2005, 16, 2436-2441.
6. Li, B.; Clark, P.A.; Church, K.H. Robust Direct-Write Dispensing Tool and Solutions for Micro/Meso-Scale Manufacturing and Packaging. In Proceedings of the 2007 International Manufacturing Science and Engineering Conference MSEC2007, Atlanta, GA, USA, 15-17 October 2007; pp. 715-721.
7. Tobjörk, D.; Kaihovirta, N.J.; Mäkelä, T.; Pettersson, F.S.; Österbacka, R. All-printed low-voltage organic transistors. Org. Electron. 2008, 9, 931-935.
8. Kim, J.W.; Lee, Y.C.; Kim, J.M.; Nah, W.; Lee, H.S.; Kwon, H.C.; Jung, S.B. Characterization of direct patterned Ag circuits for RF application. Microelectron. Eng. 2010, 87, 379-382.
9. Kadara, R.O.; Jenkinson, N.; Li, B.; Church, K.H.; Banks, C.E. Manufacturing electrochemical platforms: Direct-write dispensing versus screen printing. Electrochem. Commun. 2008, 10, 1517-1519.
10. Kirkpatrick, S. Percolation and conduction. Rev. Mod. Phys. 1973, 45, 574.
11. Shante, V.K.S.; Kirkpatrick, S. An introduction to percolation theory. Advan. Phys. 1971, 20, 325.
12. Saraf, R.F.; Roldan, J.M.; Jagannathan, R.; Sambucetti, C.; Marino, J.; Jahnes, C. Polymer/metal composite for interconnection technology. In Proceedings of the 45th Electronic Components and Technology Conference, Las Vegas, NV, USA, 22-24 May 1995; pp. 1051-1053.
13. Greer, J.R.; Street, R.A. Thermal cure effects on electrical performance of nanoparticle silver inks. Acta Mater. 2007, 55, 6345-6349.
14. Kim, D.; Moon, J. Highly conductive ink jet printed films of nanosilver particles for printable electronics. Electrochem. Solid-State Lett. 2005, 8, J30-J33.
15. Mancosu, R.D.; Quintero, J.A.Q.; Azevedo, R.E.S. Sintering, in different temperatures, of traces of silver printed in flexible surfaces. In Proceedings of the 11th International Conference on Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), Bordeaux, France, 26-28 April 2010; pp. 1-5.
16. Buffat, P.; Borel, J.P. Size effect on the melting temperature of gold particles. Phys. Rev. A 1976, 13, 2287-2298.
17. Zhao, S.; Wang, S.; Ye, H. Size-dependent melting properties of free silver nanoclusters. J. Phys. Soc. Jpn. 2001, 70, 2953-2957.
18. Yang, C.C.; Li, S. Size-dependent phase stability of silver nanocrystals. J. Phys. Chem. C 2008, 112, 16400-16404.
19. Wang, J.; Duan, H.L.; Huang, Z.P.; Karihaloo, B.L. A scaling law for properties of nano-structured materials. Proc. Roy. Soc. A Math. Phys. Eng. 2006, 462, 1355-1363.
20. DuPont Kapton® HN Polyimide Film; Technical Data Sheet. DuPont: Wilmington, DE, USA, April 2011.
21. Ferro 3309F Silver Conductor; Technical Data Sheet. Ferro Corporation: Cleveland, OH, USA, 2001.
22. DuPont CB028 Silver Conductor; Technical Data Sheet. DuPont: Wilmington, DE, USA, 2009.
23. Ercon E1660; Technical Data Sheet. Ercon Incorporated: Wareham, MA, USA, July 2007.
24. Navarrete, M.; Lopes, A.; Acuna, J.; Estrada, R.; MacDonald, E.; Palmer, J.; Wicker, R. Integrated Layered Manufacturing of a Novel Wireless Motion Sensor System with GPS. In Proceedings of the 2007 Solid Freeform Fabrication, Austin, TA, USA, 6-8 August 2007; pp. 575-585.
25. Kasap, S.O. Principles of Electrical Engineering Materials and Devices; Irwin McGraw Hill: New York, NY, USA, 1997; p. 113.
26. Bregiroux, D.; Audubert, F.; Bernache-Assollant, D. Densification and grain growth during solid state sintering of LaPO4. Ceram. Int. 2009, 35, 1115-1120.
27. Albert, A.D.; Becker, M.F.; Keto, J.W.; Kovar, D. Low temperature, pressure-assisted sintering of nanoparticulate silver films. Acta Mater. 2008, 56, 1820-1829.
28. Qin, X.Y.; Zhang, W.; Zhang, L.D.; Jiang, L.D.; Liu, X.J.; Jin, D. Low-temperature resistance and its temperature dependence in nanostructured silver. Phys. Rev. B 1997, 56, 10596-10604.
29. Huang, C.; Becker, M.F.; Keto, J.W.; Kovar, D. Annealing of nanostructured silver films produced by supersonic deposition of nanoparticles. J. Appl. Phys. 2007, 102, 054308:1-054308:8.
30. Cabot Conductive Ink CCI-300; Data Sheet; Cabot Printed Electronic Materials: Albuquerque, NM, USA, 2009
31. Stringer, J.; Derby, B. Limits to feature size and resolution in ink jet printing. J. Eur. Ceram. Soc. 2009, 29, 913-918.
32. Wang, H.T.; Nafday, O.A.; Haaheim, J.R.; Tevaarwerk, E.; Amro, N.A.; Sanedrin, R.G.; Chang, C.Y.; Ren, F.; Pearton, S.J. Toward conductive traces: Dip Pen Nanolithography® of silver nanoparticle-based inks. Appl. Phys. Lett. 2008, 93, 143105:1-143105:3.