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Volumn 1, Issue 2, 2011, Pages 242-247

Modeling thermal fatigue in CPV cell assemblies

Author keywords

Concentrating photovoltaics (CPV); fintie element model (FEM)

Indexed keywords

ACCELERATED TESTS; CELL ASSEMBLY; CELL TEMPERATURE; CONCENTRATING PHOTOVOLTAIC; EMPIRICAL EQUATIONS; EMPIRICAL METHOD; FATIGUE EQUATIONS; FINITE-ELEMENT; FINTIE ELEMENT MODEL (FEM); PHOTOVOLTAICS; TEMPERATURE CHANGES; TEMPERATURE CYCLES;

EID: 84865193163     PISSN: 21563381     EISSN: None     Source Type: Journal    
DOI: 10.1109/JPHOTOV.2011.2172575     Document Type: Article
Times cited : (12)

References (9)
  • 1
    • 78649231220 scopus 로고    scopus 로고
    • Quantifying the thermal fatigue of CPVmodules
    • N.Bosco and S.Kurtz, "Quantifying the thermal fatigue of CPVmodules," in Proc. AIP Conf., 2010, vol. 1277, pp. 225-228.
    • (2010) Proc. AIP Conf. , vol.1277 , pp. 225-228
    • Bosco, N.1    Kurtz, S.2
  • 3
    • 0142227054 scopus 로고    scopus 로고
    • A life consumption monitoring methodology for electronic systems
    • Sep
    • A. Ramakrishnan and M. G. Pecht, "A life consumption monitoring methodology for electronic systems," IEEE Trans. Compon., Packag. Technol., vol. 26, no. 3, pp. 625-634, Sep. 2003.
    • (2003) IEEE Trans. Compon., Packag. Technol. , vol.26 , Issue.3 , pp. 625-634
    • Ramakrishnan, A.1    Pecht, M.G.2
  • 4
    • 0027540946 scopus 로고
    • Generic reliability figures of merit design tools for surface mount solder attachments
    • Feb
    • W. Engelmaier, "Generic reliability figures of merit design tools for surface mount solder attachments," IEEE Trans. Compon., Hybrids, Manuf. Technol., vol. 16, no. 1, pp. 103-112, Feb. 1993.
    • (1993) IEEE Trans. Compon., Hybrids, Manuf. Technol. , vol.16 , Issue.1 , pp. 103-112
    • Engelmaier, W.1
  • 5
    • 0001481981 scopus 로고
    • Reliability of controlled collapse interconnections
    • K. C. Norris and A. H. Landzberg, "Reliability of controlled collapse interconnections," IBM J. Res. Develop., vol. 13, pp. 266-271, 1969.
    • (1969) IBM J. Res. Develop. , vol.13 , pp. 266-271
    • Norris, K.C.1    Landzberg, A.H.2
  • 7
    • 27744504368 scopus 로고    scopus 로고
    • Accelerated temperature cycle test and Coffin-Manson model for electronic packaging
    • H. Cui, "Accelerated temperature cycle test and Coffin-Manson model for electronic packaging," in Proc. Annu. Rel. Maintainability Symp., 2005, pp. 556-560.
    • (2005) Proc. Annu. Rel. Maintainability Symp. , pp. 556-560
    • Cui, H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.