Quantifying the thermal fatigue of CPV modules

AIP Conference Proceedings

Volumn 1277, Issue , 2010, Pages 225-228

  Bosco, Nick ^a   Kurtz, Sarah ^a  

^a NATIONAL RENEWABLE ENERGY LABORATORY   (United States)

Author keywords

Accelerated lifetime testing; Die attach; Rainflow; Thermal fatigue

Indexed keywords

EID: 78649231220     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.3509197     Document Type: Conference Paper

References (4)

1. D. L. King, W. E. Boyson, and J. A. Kratochvil, "Photovoltaic array performance model," Sandia National Laboratories SAND2004-3535, 2004.
2. "Standard practices for cycle counting in fatigue analysis," ASTM International Standard E 1049-85, West Conshohocken, PA 2005.
3. A. Ramakrishnan and M. G. Pecht, "A life consumption monitoring methodology for electronic systems," Components and Packaging Technologies, IEEE Transactions on, vol. 26, pp. 625-634, 2003
4. W. Engelmaier, "Generic reliability figures of merit design tools for surface mount solder attachments," Components, Hybrids, and Manufacturing Technology, IEEE Transactions on, vol. 16, pp. 103-112,1993