Effects of processing parameters of tungsten-copper composites

International Journal of Refractory Metals and Hard Materials

Volumn 35, Issue , 2012, Pages 207-212

  Abu Oqail, A ^a   Ghanim, M ^b   El Sheikh, M ^c   El Nikhaily, A ^b  

^a Beni Suef University   (Egypt)

^b SUEZ CANAL UNIVERSITY   (Egypt)

^c Mandated to Al Minia High Institute of Engineering and Technology   (Egypt)

Author keywords

Liquid phase sintering; Powder metallurgy; W Cu composite

Indexed keywords

COLD COMPACTION; COMPACTION PRESSURE; COMPRESSION STRENGTH; COPPER CONTENT; ELECTRICAL RESISTIVITY; ELEMENTAL POWDERS; HOMOGENEOUS STRUCTURE; IN-VACUUM; MIXED POWDER; NET-SHAPE; PARTICLE SIZE AND SHAPE; PROCESSING PARAMETERS; SINTERED DENSITY; SINTERING TIME; TUNGSTEN-COPPER; TUNGSTEN-COPPER COMPOSITES; W-CU COMPOSITES;

COMPACTION; COPPER; ELECTRIC CONDUCTIVITY; LIQUID PHASE SINTERING; POWDER METALLURGY; POWDERS; TUNGSTEN; TUNGSTEN ALLOYS; TUNGSTEN COMPOUNDS;

SINTERING;

EID: 84865066787     PISSN: 02634368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijrmhm.2012.02.015     Document Type: Article

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