Fabrication of W-20 wt.%Cu alloys by powder injection molding

Journal of Materials Processing Technology

Volumn 210, Issue 1, 2010, Pages 137-142

  Cheng, Jigui ^a   Wan, Lei ^a   Cai, Yanbo ^a   Zhu, Jinchuan ^a   Song, Peng ^a   Dong, Jie ^a  

^a HEFEI UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Debinding; Powder injection molding (PIM); Sintering; W Cu alloys

Indexed keywords

BINDER SYSTEMS; CU ALLOY; DEBINDING; DEBINDING PROCESS; DEFECT-FREE; ETHYLENE VINYL ACETATES; HOMOGENEOUS MICROSTRUCTURE; INJECTION-MOLDING PARAMETERS; POWDER INJECTION MOLDING; POWDER INJECTION MOLDING (PIM); RELATIVE DENSITY; SCANNING ELECTRON MICROSCOPE; SINTERING TEMPERATURES; SOLVENT DEBINDING; THERMAL DEBINDING;

ALLOYS; BINDERS; COMPRESSIVE STRENGTH; ETHYLENE; INJECTION MOLDING; INTERMODULATION; INTERMODULATION MEASUREMENT; MICROSTRUCTURE; PARAFFIN WAXES; PARAFFINS; PLASTIC MOLDS; POWDER METALLURGY; SCANNING ELECTRON MICROSCOPY; SINTERING; SOLVENT EXTRACTION; STEARIC ACID; TUNGSTEN ALLOYS; TUNGSTEN COMPOUNDS;

COPPER ALLOYS;

EID: 71849113112     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2009.08.001     Document Type: Article

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