Preparation of W-Cu nano-composite powder using a freeze-drying technique

International Journal of Refractory Metals and Hard Materials

Volumn 28, Issue 2, 2010, Pages 301-304

  Xi, Xiaoli ^a   Xu, Xiangyang ^a   Nie, Zuoren ^a   He, Shan ^a   Wang, Wei ^a   Yi, Jie ^a   Tieyong, Zuo ^a  

^a BEIJING UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Freeze drying; Nanocomposite; W Cu powder

Indexed keywords

CRYSTAL WATERS; DRYING TECHNIQUE; ELECTRONIC PACKAGING MATERIAL; ENVIRONMENT FRIENDLY; FIELD EMISSION SCANNING ELECTRON MICROSCOPY; FREEZE-DRYING; LIQUID SOLUTION; META-TUNGSTATE; NANO POWDERS; PURE TUNGSTEN; REDUCTION PROCESS; THERMAL DECOMPOSITIONS; TWO STAGE; VACUUM DRYING; W-CU COMPOSITES; W-CU POWDER;

AMMONIUM COMPOUNDS; COMPLEXATION; COMPOSITE MICROMECHANICS; COPPER POWDER METALLURGY; CURING; DEWATERING; ELECTRONICS PACKAGING; FIELD EMISSION; FIELD EMISSION MICROSCOPES; INFRARED SPECTROSCOPY; LIQUID NITROGEN; LIQUIDS; LOW TEMPERATURE DRYING; NANOCOMPOSITES; NANOSTRUCTURED MATERIALS; PYROLYSIS; SCANNING ELECTRON MICROSCOPY; TUNGSTEN; TUNGSTEN ALLOYS; TUNGSTEN COMPOUNDS;

PACKAGING MATERIALS;

EID: 74849105456     PISSN: 02634368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijrmhm.2009.10.014     Document Type: Article

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