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Volumn 473, Issue 1-2, 2009, Pages 107-115
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Effects of processing parameters on consolidation and microstructure of W-Cu components by DMLS
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Author keywords
Laser processing; Metals and alloys; Microstructure; Sintering
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Indexed keywords
BONDING;
COPPER ALLOYS;
LASER HEATING;
LASERS;
MELTING;
METALLURGY;
MICROSTRUCTURE;
POWDER METALS;
PULSED LASER DEPOSITION;
SMELTING;
TUNGSTEN COMPOUNDS;
COMBINED EFFECTS;
CONTINUOUS MELTING;
CORE STRUCTURES;
DENSIFICATION BEHAVIORS;
HIGH DENSITIES;
HOMOGENEOUS MICROSTRUCTURES;
INTEGRATED PROCESS CONTROLS;
LASER POWER;
LASER PROCESSING;
LINEAR ENERGIES;
METALS AND ALLOYS;
MICROSTRUCTURAL CHARACTERISTICS;
POWDER LAYERS;
POWDER MELTING;
POWDER SYSTEMS;
PROCESSING CONDITIONS;
PROCESSING PARAMETERS;
SCAN LINE SPACINGS;
SINTERED PARTS;
SINTERING MECHANISMS;
SUB MICRONS;
THEORETICAL DENSITIES;
VOLUMETRIC ENERGY DENSITIES;
SINTERING;
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EID: 61449229964
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2008.05.065 Document Type: Article |
Times cited : (174)
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References (35)
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