Electrochemical deposition and characterization of cupric oxide thin films

Thin Solid Films

Volumn 520, Issue 21, 2012, Pages 6608-6613

  Dhanasekaran, V ^a   Mahalingam, T ^a   Chandramohan, R ^b   Rhee, Jin Koo ^c   Chu, J P ^d  

^a ALAGAPPA UNIVERSITY   (India)

^b Sree Sevugan Annamalai College   (India)

^c Dongguk University   (South Korea)

^d NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Cupric oxide; Electrodeposition; Indirect band gap; Structural properties; Surface morphology; Thin film

Indexed keywords

ALKALINE SOLUTIONS; BATH TEMPERATURES; CATHODIC ELECTRODEPOSITION; COMPLEX DIELECTRIC CONSTANT; CUBIC STRUCTURE; CUPRIC OXIDE; DEPOSITED FILMS; DIFFRACTION LINES; ELECTROCHEMICAL DEPOSITION; ENERGY DISPERSIVE ANALYSIS; EXTINCTION COEFFICIENT (K); INDIRECT BAND GAP; INDIUM TIN OXIDE COATED GLASS; MIXED PHASIS; MORPHOLOGICAL PROPERTIES; NEAR STOICHIOMETRIC; POLYCRYSTALLINE; PREFERENTIAL ORIENTATION; TEXTURE COEFFICIENT; X-RAY DIFFRACTION STUDIES;

ATOMIC FORCE MICROSCOPY; ELECTRODEPOSITION; OPTICAL CONSTANTS; OPTIMIZATION; OXIDE FILMS; REDUCTION; REFRACTIVE INDEX; SCANNING ELECTRON MICROSCOPY; STRUCTURAL PROPERTIES; SUBSTRATES; SURFACE MORPHOLOGY; SURFACE ROUGHNESS; TIN; TIN OXIDES; X RAY DIFFRACTION;

THIN FILMS;

EID: 84864753480     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2012.07.021     Document Type: Article

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