Properties of copper-aluminum oxide films prepared by solution methods

Thin Solid Films

Volumn 411, Issue 1, 2002, Pages 129-133

  Tonooka, Kazuhiko ^a   Shimokawa, Katsuyoshi ^a   Nishimura, Okio ^b  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

Author keywords

CuAlO2 films; Dip coating; Solution method; Transparent conducting oxide

Indexed keywords

CALCINATION; COMPOSITION; CONDUCTIVE FILMS; COPPER COMPOUNDS; ELECTRIC CONDUCTANCE; ELECTRIC VARIABLES MEASUREMENT; SOL-GELS; THERMOGRAVIMETRIC ANALYSIS; X RAY DIFFRACTION ANALYSIS;

SOLUTION METHODS;

THIN FILMS;

EID: 0037157433     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(02)00201-8     Document Type: Conference Paper

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