Smart-cut layer transfer of single-crystal SiC using spin-on-glass

Journal of Vacuum Science and Technology B:Nanotechnology and Microelectronics

Volumn 30, Issue 4, 2012, Pages

  Lee, Jae Hyung ^a   Bargatin, Igor ^a,b   Park, Joonsuk ^a   Milaninia, Kaveh M ^c   Theogarajan, Luke S ^c   Sinclair, Robert ^a   Howe, Roger T ^a  

^a Stanford University   (United States)

^b UNIVERSITY OF PENNSYLVANIA   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL MECHANICAL POLISHING; SURFACE ROUGHNESS;

ADHESION LAYER; HIGH TEMPERATURE; LAYER TRANSFER; LOW TEMPERATURES; MEMS-STRUCTURE; ROUGHNESS TOLERANCES; SINGLE CRYSTAL SILICON; SMART-CUT; SPIN-ON-GLASS;

SILICON CARBIDE;

EID: 84864249445     PISSN: 21662746     EISSN: 21662754     Source Type: Journal    
DOI: 10.1116/1.4734006     Document Type: Article

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