Silver content effect on rheological and electrical properties of silver pastes

Journal of Materials Science: Materials in Electronics

Volumn 23, Issue 7, 2012, Pages 1415-1426

  Faddoul, Rita ^a   Reverdy Bruas, Nadège ^a   Bourel, Joséphine ^a  

^a Laboratory of Pulp and Paper Industry LGP2 UMR CNRS 5518   (France)

Author keywords

[No Author keywords available]

Indexed keywords

AROMATIC SOLVENT; BINGHAM MODEL; CERAMIC SUBSTRATES; CERAMIC TAPES; ELECTRICAL RESISTIVITY; ENVIRONMENTALLY-FRIENDLY; HIGH TEMPERATURE; LINE RESISTIVITY; MEAN DIAMETER; MICROWAVE TRANSMISSION LINE; REDUCING WASTE; RHEOLOGICAL BEHAVIOUR; SCREEN-PRINTED; SILVER CONTENT EFFECT; SILVER INKS; SILVER PASTES; SPHERICAL PARTICLE; THIXOTROPIC BEHAVIOUR; TOPOGRAPHY MEASUREMENT; VISCOSITY EVOLUTION; WATER BASED;

CURING; ELECTRIC CONDUCTIVITY; ORGANIC SOLVENTS; RHEOLOGY; SCREEN PRINTING; SINTERED ALUMINA; SINTERING;

SILVER;

EID: 84863984669     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-011-0607-3     Document Type: Article

References (26)

1. G.M. Kim, M.A.F. van den Boogaart, J. Brugger, Microelectron. Eng. 67-68, 609-614 (2003)
2. R. Parashkov, E. Becker, T. Riedl, H.-H. Johannes, W. Kowalsky, Proc. IEEE 93(7), 1321-1329 (2005)
3. A. Sanson, E. Mercadelli, E. Roncari, R. Licheri, R. Orru, G. Cao, E. Merlone-Borla, D. Marzorati, A. Bonavita, G. Micali, G. Neri, Ceram. Int. 36, 521-527 (2010)
4. W. Yin, D.-H. Lee, J. Choi, C. Park, S. Min Cho, Korean J. Chem. Eng. 25(6), 1358-1361 (2008)
5. A.A. Yussuf, I. Sbarski, M. Solomon, N. Tran, J.P. Hayes, J. Mater. Process. Technol. 189(1-3), 401-408 (2007)
6. R.M. Pemberton, F.J. Rawson, J. Xu, R. Pittson, G.A. Drago, J. Griffiths, S.K. Jackson, J.P. Hart, Microchim. Acta. 170, 321-330 (2010)
7. R.M. Pemberton, J. Xu, R. Pittson, G.A. Drago, J. Griffiths, S.K. Jackson, J.P. Hart, Biosens. Bioelectron. 26, 2448-2453 (2010)
8. G. Guo, W. Gan, F. Xiang, J. Zhang, H. Zhou, H. Liu, J. Luo, J. Mater Sci. Mater Electron 22, 527-530 (2011)
9. M. Yamamoto, H. Kakiuchi, Y. Kashiwagi, Y. Yoshida, Bull. Chem. Soc. Jpn. 83(11), 1386-1391 (2010)
10. S. Jagtap, V. Deshpande, V. Rane, S. Rane, G. Phatak, D. Amalnerkar, J. Mater. Sci. Mater. Electron. 19, 522-527 (2008)
11. S. Datta, K. Keller, D.L. Schulz, D.C. Webster, IEEE Trans. Compon. Packag. Manuf. Technol. 1(1), 69-75 (2011)
12. T.-X. Liang, W.Z. Sun, Y.H. Wang, H.-D. Li, IEEE Trans. Compon. Packag. Manuf. Technol. Part B 19(2), 423-426 (1996)
13. Y. Wang, G. Zhang, J. Ma, Mater. Sci. Eng. B94, 48-53 (2002)
14. C. Zhong, C. Duan, F. Huang, H. Wu, Y. Cao, Chem. Mater. Rev. 23, 326-340 (2011)
15. W. Songping, J. Mater. Sci. Mater. Electron. 18(4), 447-452 (2007)
16. S. Merilampi, T. Laine-Ma, P. Ruuskanen, Microelectron. Reliab. 49, 782-790 (2009)
17. N. Midoux, Mécaniques et rhéologie des fluides en génie chimique ENSIC-Tec & Doc (1993)
18. T. Maeder, Introduction aux pâtes/encres de sérigraphie en technologie de couches épaisses. (Ecole Polytechnique Fédérale de Lausanne, 2008)
19. R.H. Leach, R.J. Pierce, The Printing Ink Manual (Kluwer, Dordrecht, 1993)
20. L. Shiyong, W. Ning, X. Wencai, L. Yong, Mater. Chem. Phys. 111, 20-23 (2008)
21. J.W. Goodwin, R.W. Hughes, Rheology for Chemists: An Introduction. Royal Society of Chemistry (2008)
22. M. Neidert, W. Zhang, D. Zhang, A. Kipka, A.-PVSC-He-reaus-voltaics.com (2008)
23. S.B. Rane, P.K. Khanna, T. Seth, G.J. Phatak, D.P. Amalnerkar, B.K. Das, Mater. Chem. Phys. 82, 237-245 (2003)
24. D. Buzby, A. Dobie, Hereaus White Papers (2011)
25. S.L. Morisette, J.A. Lewis, J. Am. Ceram. Soc. 84(11), 2462-2468 (2001)
26. S. Rane, V. Puri, J. Mater. Sci. Mater. Electron. 11, 667-674 (2000)