Preparation and rheological behavior of lead free silver conducting paste

Materials Chemistry and Physics

Volumn 111, Issue 1, 2008, Pages 20-23

  Shiyong, Luo ^a   Ning, Wang ^b   Wencai, Xu ^a   Yong, Lv ^a  

^a BEIJING INSTITUTE OF GRAPHIC COMMUNICATION   (China)

^b INSTITUTE OF GEOCHEMISTRY   (China)

Author keywords

Chemical techniques; Coating; Electrical conductivity; Electronic materials

Indexed keywords

ADHESION; ADHESIVE PASTES; LEAD; RHEOLOGY; SILVER; VICKERS HARDNESS;

CHEMICAL TECHNIQUES; ELECTRONIC MATERIALS;

CONDUCTING POLYMERS;

EID: 44249111631     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.matchemphys.2007.11.042     Document Type: Article

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