Preparation of micron size flake silver powders for conductive thick films

Journal of Materials Science: Materials in Electronics

Volumn 18, Issue 4, 2007, Pages 447-452

  Songping, Wu ^a  

^a SOUTH CHINA UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; DENSIFICATION; ELECTRIC CONDUCTIVITY; ENERGY DISPERSIVE SPECTROSCOPY; GRAIN BOUNDARIES; SCANNING ELECTRON MICROSCOPY; SILVER POWDER METALLURGY; SURFACE ACTIVE AGENTS; THERMOANALYSIS;

ASCORBIC ACID; MICRON SIZE FLAKE SILVER POWDERS; SILVER NITRATE;

THICK FILMS;

EID: 33846046889     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-006-9042-2     Document Type: Article

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