Direct stamping of silver nanoparticles toward residue-free thick electrode

Science and Technology of Advanced Materials

Volumn 13, Issue 3, 2012, Pages

  Kim, Jiseok ^a   Wubs, Kevin ^a   Bae, Byeong Soo ^b   Soo Kim, Woo ^a  

^a SIMON FRASER UNIVERSITY   (Canada)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

direct stamping; flexible sensors; silver nanoparticles; strain sensors

Indexed keywords

ADHESIVE LAYERS; ENERGY DISPERSIVE X-RAY SPECTROSCOPY ANALYSIS; FACILE FABRICATION; FLEXIBLE SENSOR; FLEXIBLE STAMP; FLEXIBLE SUBSTRATE; HIGH ASPECT RATIO; INTER-DIGITATED ELECTRODES; INTERDIGITATED CAPACITORS; MICRO-SCALES; NO RESIDUAL LAYERS; PREPOLYMERS; RESIDUAL LAYERS; SCANNING ELECTRON MICROSCOPY IMAGE; SILVER NANOPARTICLES; STRAIN SENSORS; THICK ELECTRODES;

ASPECT RATIO; CHEMICAL SENSORS; FUNCTIONAL MATERIALS; NANOPARTICLES; SCANNING ELECTRON MICROSCOPY; STAMPING; X RAY SPECTROSCOPY;

SILVER;

EID: 84863856937     PISSN: 14686996     EISSN: None     Source Type: Journal    
DOI: 10.1088/1468-6996/13/3/035004     Document Type: Article

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