Effect of solidification parameters on the microstructure of directionally solidified Sn-Bi-Zn lead-free solder

Metals and Materials International

Volumn 18, Issue 2, 2012, Pages 349-354

  Cadlrll E ^a   Boyuk U ^b   Kaya, H ^b   Marasli N ^b  

^a NIGDE UNIVERSITY   (Turkey)

^b ERCIYES UNIVERSITY   (Turkey)

Author keywords

Alloys; Crystal growth; Microstructure; Soldering; Solidification

Indexed keywords

ALLOYING; BINARY ALLOYS; BISMUTH ALLOYS; BISMUTH METALLOGRAPHY; CRYSTAL GROWTH; FLUORESCENCE SPECTROSCOPY; GROWTH RATE; MICROSTRUCTURE; SOLDERING; SOLIDIFICATION; TERNARY ALLOYS; THERMAL GRADIENTS; TIN ALLOYS; TIN METALLOGRAPHY; ZINC ALLOYS; ZINC METALLOGRAPHY;

CONSTANT GROWTH RATES; CONSTANT TEMPERATURE; DIRECTIONAL SOLIDIFICATION FURNACE; DIRECTIONALLY SOLIDIFIED; EUTECTIC SPACINGS; LEAD-FREE SOLDER ALLOY; SOLIDIFICATION PARAMETER; WAVELENGTH DISPERSIVE X-RAY FLUORESCENCE SPECTROMETRIES;

LEAD-FREE SOLDERS;

EID: 84863812018     PISSN: 15989623     EISSN: 20054149     Source Type: Journal    
DOI: 10.1007/s12540-012-2021-7     Document Type: Article

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