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Volumn 470, Issue 1-2, 2009, Pages 150-156
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The effect of growth rate on microstructure and microindentation hardness in the In-Bi-Sn ternary alloy at low melting point
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Author keywords
Crystal growth; Directional solidification; Intermetallics; Metals; Ternary alloy
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Indexed keywords
BINARY ALLOYS;
CRYSTAL GROWTH;
CRYSTALLIZATION;
GRAIN BOUNDARIES;
GROWTH (MATERIALS);
INTERMETALLICS;
MELTING POINT;
METALLIC COMPOUNDS;
MICROHARDNESS;
REGRESSION ANALYSIS;
SMELTING;
SOLIDIFICATION;
STEELMAKING;
TERNARY ALLOYS;
TERNARY SYSTEMS;
THERMOCHEMISTRY;
TIN;
TIN ALLOYS;
BRIDGMAN;
CONSTANT TEMPERATURES;
DIRECTIONAL SOLIDIFICATION;
DIRECTIONAL SOLIDIFICATION FURNACES;
DIRECTIONALLY SOLIDIFIED;
LAMELLAR SPACINGS;
LINEAR REGRESSION ANALYSIS;
LONGITUDINAL SECTIONS;
LOW MELTING POINTS;
METALS;
MICROINDENTATION HARDNESS;
TERNARY ALLOY;
ALLOYS;
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EID: 59249103748
PISSN: 09258388
EISSN: None
Source Type: Journal
DOI: 10.1016/j.jallcom.2008.02.056 Document Type: Article |
Times cited : (45)
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References (40)
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