Integration method for electronics in woven textiles

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 2, Issue 7, 2012, Pages 1107-1117

  Zysset, Christoph ^a   Kinkeldei, Thomas Wilhelm ^a   Munzenrieder, Niko ^a   Cherenack, Kunigunde ^a   Tröster, Gerhard ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

Smart textiles; system in textiles; textile interconnects; wearable computing

Indexed keywords

BENDING RIGIDITY; BUS TOPOLOGY; CONDUCTIVE THREADS; CONTACT PADS; DIGITAL TEMPERATURE SENSOR; FLEXIBLE PLASTIC SUBSTRATES; FUNCTIONALIZED; INTEGRATION METHOD; INTERCONNECT LINES; LARGE-SCALE MANUFACTURING; SHEAR FORCE; SMART TEXTILES; SYSTEM-IN-TEXTILES; WEARABLE COMPUTING; WOVEN TEXTILES;

FLEXIBLE ELECTRONICS; TEMPERATURE SENSORS; THIN FILM DEVICES; WEARABLE COMPUTERS; WEAVING;

TEXTILES;

EID: 84863784266     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2012.2189770     Document Type: Article

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