Woven Thin-Film metal interconnects

IEEE Electron Device Letters

Volumn 31, Issue 7, 2010, Pages 740-742

  Cherenack, Kunigunde H ^a   Kinkeldei, Thomas ^a   Zysset, Christoph ^a   Troster, Gerhard ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

Large scale integration; resistance measurement; strain control; strip conductors; textile industry

Indexed keywords

BENDING RADIUS; BENDING STRAIN; E-TEXTILES; ELECTRONIC TEXTILES; ELECTRONIC YARNS; INTERCONNECT LINES; INTERCONNECT RESISTANCE; LARGE SCALE INTEGRATION; RESISTANCE MEASUREMENT; STRIP CONDUCTORS; THIN FILM METAL; WEAVING MACHINE; WEAVING PATTERNS;

AGRICULTURAL PRODUCTS; ELECTRIC RESISTANCE MEASUREMENT; FABRICS; LIGHT EMITTING DIODES; LSI CIRCUITS; STRAIN CONTROL; TEXTILE INDUSTRY; THIN FILM DEVICES;

WEAVING;

EID: 77954144362     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/LED.2010.2048993     Document Type: Article

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