Weaving integrated circuits into textiles

Proceedings - International Symposium on Wearable Computers, ISWC

Volumn , Issue , 2010, Pages

  Zysset, Christoph ^a   Cherenack, Kunigunde ^a   Kinkeldei, Thomas ^a   Tröster, Gerhard ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

BUS STRUCTURES; BUS TOPOLOGY; CLOTHING LAYERS; CONDUCTIVE TEXTILES; CONTACT PADS; DRAPABILITY; ELECTRONIC FUNCTIONALITY; FLEXIBLE PLASTIC SUBSTRATES; HEAT STROKE; INTEGRATION METHOD; INTERCONNECT LINES; LARGE-SCALE MANUFACTURING; SILICON-BASED INTEGRATED CIRCUITS; SMART TEXTILES; TEXTILE PROPERTIES; WEARABLE COMPUTING; WEAVING MACHINE; WOVEN TEXTILES;

FABRICS; FIBERS; INTEGRATED CIRCUITS; INTEGRATION; SENSORS; SUBSTRATES; TECHNOLOGY; THIN FILM CIRCUITS; THIN FILM DEVICES; WEARABLE COMPUTERS;

WEAVING;

EID: 78651385699     PISSN: 15504816     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISWC.2010.5665874     Document Type: Conference Paper

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