Influence of plastic deformation on evolution of defect structures, microhardness and electrical conductivity of copper

Materials Technology

Volumn 27, Issue 1, 2012, Pages 82-84

  Tao, J M ^a   Xu, M C ^a   Li, C J ^a   Zhu, X K ^a  

^a KUNMING UNIVERSITY OF SCIENCE AND TECHNOLOGY   (China)

Author keywords

Copper; Deformation twins; Electrical conductivity; Ultrafine grained materials

Indexed keywords

ANNEALED COPPER; COLD DRAWING; COLD FORGING; DEFORMATION PROCESS; DEFORMATION STRAIN; DEFORMATION TWIN; DEFORMATION TWINS; DISLOCATION DENSITIES; DYNAMIC RECOVERY; ELECTRICAL CONDUCTIVITY; FOUR-PROBE METHODS; HIGH ELECTRICAL CONDUCTIVITY; LARGE DEFORMATIONS; LIQUID NITROGEN TEMPERATURE; ULTRAFINE GRAINED MATERIALS; ULTRAFINE-GRAINED; X-RAY DIFFRACTION MEASUREMENTS;

DEFORMATION; ELECTRIC CONDUCTIVITY; MICROHARDNESS; STRAIN; X RAY DIFFRACTION;

COPPER;

EID: 84863292716     PISSN: 10667857     EISSN: 17535557     Source Type: Journal    
DOI: 10.1179/175355511X13240279340444     Document Type: Article

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