High strength and high electrical conductivity bulk Cu

Philosophical Magazine

Volumn 84, Issue 34, 2004, Pages 3705-3716

  Han, K ^a   Walsh, R P ^a   Ishmaku, A ^a   Toplosky, V ^a   Brandao, L ^b   Embury, J D ^c  

^a FLORIDA STATE UNIVERSITY   (United States)

^b MILITARY INSTITUTE OF ENGINEERING   (Brazil)

^c MCMASTER UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; DISLOCATIONS (CRYSTALS); ELECTRIC CONDUCTIVITY; ELECTRON ABSORPTION; ENERGY ABSORPTION; STRENGTH OF MATERIALS; YIELD STRESS;

ANNIHILATION; CELL BOUNDRIES; LIQUID NITROGEN TEMPERATURE (LNT); PURE METALS;

COPPER;

EID: 10644254602     PISSN: 14786435     EISSN: None     Source Type: Journal    
DOI: 10.1080/14786430412331293496     Document Type: Article

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