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Volumn 91, Issue 21, 2007, Pages

High strength and high electrical conductivity in bulk nanograined Cu embedded with nanoscale twins

Author keywords

[No Author keywords available]

Indexed keywords

CRYOGENICS; ELECTRIC CONDUCTIVITY; TENSILE STRENGTH; YIELD STRESS;

EID: 36349004658     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2816126     Document Type: Article
Times cited : (77)

References (15)
  • 3
    • 37049007164 scopus 로고    scopus 로고
    • Microstructural Evolution and Nanostructure Formation in Copper during Dynamic Plastic Deformation at Cryogenic Temperatures
    • Y. S. Li, N. R. Tao, and K. Lu, " Microstructural Evolution and Nanostructure Formation in Copper During Dynamic Plastic Deformation at Cryogenic Temperatures., " Acta Mater. (in press).
    • Acta Mater.
    • Li, Y.S.1    Tao, N.R.2    Lu, K.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.