Synthesis and properties of an epoxy resin containing trifluoromethyl side chains and its cross-linking networks with different curing agents

Polymer Degradation and Stability

Volumn 97, Issue 5, 2012, Pages 691-697

  Liu, Zhongguo ^a   Zhang, Gang ^a   Liu, Zhuang ^a   Sun, Hongcheng ^a   Zhao, Chengji ^a   Wang, Shuang ^a   Li, Guibin ^a   Na, Hui ^a  

^a JILIN UNIVERSITY   (China)

Author keywords

Contact angle; Epoxy resin; Glass transition temperature; Thermal stability; Trifluoromethyl

Indexed keywords

CURING AGENTS; DECOMPOSITION TEMPERATURE; EPOXY NETWORK; GLASS-TRANSITION TEMPERATURE; HYDROPHOBIC PROPERTIES; MOISTURE ABSORPTION; POLY(PROPYLENE GLYCOL); SIDE-CHAINS; TRIFLUOROMETHYL; WEIGHT LOSS;

COMPLEXATION; CONTACT ANGLE; CURING; EPOXY RESINS; ETHERS; THERMODYNAMIC STABILITY;

RESINS;

EID: 84862806120     PISSN: 01413910     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymdegradstab.2012.02.012     Document Type: Article

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