Thermal properties of phthalic anhydride- and phenolic resin-cured rigid rod epoxy resins

Thermochimica Acta

Volumn 392-393, Issue , 2002, Pages 395-398

  Su, Wei Fang ^a   Lee, Yin Chung ^a   Pan, Wei Ping ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Phenolic resin; Phthalic anhydride; Rigid rod epoxy; Thermal properties

Indexed keywords

4,4' ISOPROPYLIDENEDIPHENOL; BIPHENYL DERIVATIVE; EPOXY RESIN; GLASS; PHENOL DERIVATIVE; PHTHALIC ANHYDRIDE;

CONFERENCE PAPER; DECOMPOSITION; DIFFERENTIAL SCANNING CALORIMETRY; PHASE TRANSITION; THERMAL ANALYSIS; THERMOGRAVIMETRY; THERMOSTABILITY;

EID: 0037106820     PISSN: 00406031     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6031(02)00126-0     Document Type: Article

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5. M.G. Lu, M.J. Shim, S.W. Kim, J. Appl. Polym. Sci. 75 (2000) 1514.
6. K.J. Saunders, Organic Polymer Chemistry, Chapman and Hall, London, 19138.