Reaction kinetics and thermal properties of epoxidised cresol novolac/4,4'-diglycidyl (3,3',5,5'-tetramethylbiphenyl) epoxy resin composite cured with aromatic diamine

Polymer International

Volumn 60, Issue 10, 2011, Pages 1556-1562

  Liu, Zhongguo ^a   Zhang, Gang ^a   Tu, Kuifeng ^a   Zhao, Sen ^a   Han, Miaomiao ^a   Ni, Jing ^a   Ma, Wenjia ^a   Na, Hui ^a  

^a JILIN UNIVERSITY   (China)

Author keywords

4,4' diglycidyl(3,3',5,5' tetramethylbiphenyl) epoxy resin; Electronic packaging materials; Epoxidised cresol novolac; Kinetics

Indexed keywords

AROMATIC DIAMINE; CURE KINETICS; CURING AGENTS; DIAMINODIPHENYLSULFONE; ELECTRONIC PACKAGING; ELECTRONIC PACKAGING MATERIAL; EPOXY RESIN COMPOSITES; HIGH THERMAL STABILITY; IMPACT PROPERTY; ISO-CONVERSIONAL METHOD; MOISTURE ABSORPTION; NOVOLAC;

BLENDING; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DYNAMIC ANALYSIS; DYNAMIC MECHANICAL ANALYSIS; ELECTRONICS PACKAGING; ENZYME KINETICS; KINETICS; PACKAGING MATERIALS; PHASE SEPARATION; REACTION KINETICS; RESINS; SCANNING ELECTRON MICROSCOPY; THERMODYNAMIC PROPERTIES; THERMOGRAVIMETRIC ANALYSIS;

EPOXY RESINS;

EID: 80052883725     PISSN: 09598103     EISSN: 10970126     Source Type: Journal    
DOI: 10.1002/pi.3119     Document Type: Article

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