Low-k and high thermal stable fluorinated epoxy materials for advanced microelectronic packaging applications

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2007, Pages

  Zhiqiang, Tao ^a   Yang, Haixia ^a   Lin, Fan ^a   Shiyong, Yang ^a  

^a INSTITUTE OF CHEMISTRY   (China)

Author keywords

Dielectric properties; Fluorinated epoxy; Water absorption

Indexed keywords

DIELECTRIC MATERIALS; ELECTRONICS PACKAGING; FLUORINE; MECHANICAL PROPERTIES; PERMITTIVITY; SYNTHESIS (CHEMICAL); THERMODYNAMIC STABILITY;

CURED EPOXY RESINS; FLUORINATED EPOXY; LOWER DIELECTRIC CONSTANTS;

EPOXY RESINS;

EID: 34948816018     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359806     Document Type: Conference Paper

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